Wire Bond Process Manager

Job description This rapidly expanding Semiconductor company in Malacca is seeking a Wire Bond Process Manager. Key Responsibilities:Perform process optimization to achieve the better wire bond yield and product quality as well as process robustness to meet the process Cpk.Hands on for recipe management system in consolidating the wire bond recipes by different die type, package type and design ID.Involved actively in solving wire bond related issues broken wires, lifted pad, slack wires, lifted stitch, IMC crack, bond pad crack) through 8D methodology.