Wire Bond Process Development Engineer

Major Duties and Responsibilities:
Responsible for introducing new products from characterization, validation, large scale, qualification, and safe launch for mass production releases in thermosonic and/or ultrasonic wire-bond process Performs package design review, and risk analysis and conducts studies on materials suitable for the package & process Review engineering builds requirements and engineering instructions for new products Responsible for reviewing, generating, updating, and approving specifications Achieves operational objectives by contributing information and recommendations on new product releases Preparing and completing assembly build qualification reports, production release documents per device and systems configurations, safe launch reports for initial production released parts #J-18808-Ljbffr