2022 Development Engineering Intern

Western Digital is hiring for the role of Development Engineering Intern 2022.
Opportunity details Opportunity Type
Internship, Clerkship or Placement
Applications Open
Applications Close
Accepting International Applications
No
Qualifications Accepted
E
Responsibilities Conduct basic engineering research to support process improvement initiatives. Understanding the Fundamentals of Lapping plate preparation. Provide technical assistance to characterize the Lapping Plates. Understanding / exploring a new method of fabricating lapping plates. Qualifications Undergraduate degree in BS Metallurgical Engineering or BS Materials Engineering. Strong analytical, problem-solving skills and quick learner Graduate Success Stories Graduate stories I am a Licensed Electronics Engineer and Electronics Technician from the University of Santo Tomas. I am a Fresh Graduate and currently working at Western Digital in Biñan, Laguna. Process Validation and Integration – Characterization
Graduate stories I am a Licensed Electronics Engineer and Electronics Technician from the University of Santo Tomas. I am a Fresh Graduate and currently working at Western Digital in Biñan, Laguna. Process Validation and Integration – Characterization
I am a Licensed Electronics Engineer and Electronics Technician from the University of Santo Tomas. I am a Fresh Graduate and currently working at Western Digital in Biñan, Laguna.
Process Validation and Integration – Characterization
Graduate stories I am a Licensed Electronics Engineer and Electronics Technician from the University of Santo Tomas. I am a Fresh Graduate and currently working at Western Digital in Biñan, Laguna. Process Validation and Integration – Characterization
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