The Allegro team is passionate about providing intelligent solutions that move the world toward a safer and more sustainable future. With more than 30 years of experience developing advanced semiconductor technology, innovation with purpose touches every aspect of our business. From customer engagement and employee recognition to technology advancement and serving the local communities in which we maintain offices, innovation consistently drives our mission and definition of success.
JOB RESPONSIBILITIES: Process Set-up and Development: Process Parameter Optimization:
Optimizes process parameters by experimental designs, process variable definitions and robust design engineering for new packages or continuous improvement.
Improvement of Existing Methods and Conception of New Methods:
Conceives, sources out and tests alternative and new methods/processes to improve manufacturability, yield, and quality. Spearheads generation of FMEA for new Assembly processes and reviews until completion of qualification.
Equipment Qualification and Development:
Designs and/or qualifies jigs, fixtures, and tools to enhance machine efficiency and improve product quality. Generates and/or reviews equipment specifications and qualification procedures, and supporting documents for PAR of new equipment. Spearheads machine qualification and monitoring, and/or conducts equipment buy-off at supplier site. Recommends machine modifications whenever necessary.
Material Development:
Sources out, evaluates and recommends alternative materials to reduce cost, enhance quality, and improve manufacturability.
Product Development:
Determines machine and process capability for new products. Ensures that engineering lots for new devices and packages are assembled in conformance to all requirements and process concerns are reported.
Cost Reduction and Yield Improvement:
Plans, designs, implements and monitors activities geared to improve product and material yield, reduce production cost and/or reduce product reliability defects.
Standardization and Documentation:
Generates, interprets, and updates process and material specifications and flowcharts for new package projects. Interprets quality inspection criteria and specifications. Prepares technical reports on the results of evaluations and investigations, and presents recommended actions.
Training:
Conducts process training for new Engineers and Technicians. Provides initial training to production personnel on new processes.
Coordination/Communication of Process Issues for Improved Quality, Manufacturability and Reliability:
Coordinates quality, manufacturability, process control and reliability issues with internal and external customers. Facilitates discussion of material and equipment quality and performance issues with supplier/s.
MINIMUM QUALIFICATIONS: Degree in Mechanical/Electrical / Electronics and Communication /Materials / Metallurgical Engineering. With at least three years' experience in the conduct of thermomechanical simulations related to Package Development and New Product Introduction in a semiconductor assembly environment for leadframe and substrate-based packages. Working knowledge of downstream and upstream Assembly processes and the impact of the design to the input and output of these processes. Working knowledge on the principles of Design for Manufacturability, DFMEA. Working knowledge on the use of statistical methods of experimentation and analysis and their associated application/tools (DOE, SAS-JMP, Minitab, others) to establish and improve Process and Equipment Capability. Working knowledge and application of the Advance Quality Core tools (Process Flow, FMEA, Control Plan). Working knowledge and application of Problem-Solving Methods and use of the appropriate analytical techniques to establish cost effective and efficient solutions. Effective written, oral communication, presentation skills. Exhibit critical thinking with solution provider mindset. High level of mechanical reasoning and drawing. Good working knowledge of Continuous Improvement Principles. Good people skills.
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